Small Pixel Pitch LED Display Application Status and Trend Analysis: Accelerating the Process of Pitch Miniaturization

This time, DISCIEN sampled and investigated 40 Small Pixel Pitch LED Display project cases that won the bid in 2021, mainly for the application of P0.9 mm, which will be viewed from three dimensions of application scenario, monomer area and transaction price;

Small Pixel Pitch LED Display Application Status and Trend Analysis: Accelerating the Process of Pitch Miniaturization

Application scenarios of fine Pixel Pitch LED display: conference & command and dispatch applications are the main ones, and the application area of command and dispatch projects is significantly larger than that of conference applications; from the perspective of actual project application scenarios, the number of projects in conference scenarios is the largest, accounting for 46.4%, followed by command and dispatch; However, from the perspective of shipment area, the proportion of command and dispatch is as high as 58.6%, which shows that the application area of command and dispatch scenario is significantly larger than that of the conference and other applications. Single project area: more than half of 10-30 ㎡; from the project cases sorted out, nearly 80% of the single area of Narrow Pixel Pitch LED Display is more than 10 ㎡, of which 10-30 ㎡ is the most, accounting for 54%. With the downward shift of spacing, the resolution per unit area will continue to improve, and the application area will gradually expand to a small area. Transaction price-concentrated above 100,000 yuan/㎡ for Small Pixel Pitch LED Screen; From the current P0.9 transaction price, we can find that the current price is still at a high level, nearly 77% of the project end-users have an average transaction price of more than 100000 yuan/m2, the lowest number of projects of 80000-90000 yuan/m2 only accounts for less than 8%, with the maturity of products, the improvement of yield, large-scale application and the introduction of smaller spacing in the future. DISCIEN expects that P0.9 will also show a price reduction rate of more than -10% per year in the next three years. 

Packaging technology-With the continuous downward shift of spacing, the COG advantage will continue to emerge; from the perspective of packaging technology, there is a situation of letting a hundred flowers blossom and a hundred schools of thought contend. SMD and COB technologies are continuously upgraded, and COG technology is the farthest to be seen. DISCIEN believes that the application advantages of each packaging technology in the future need to be divided into different segments. The traditional SMD technology will still be above P1.8, and SMD will still be the mainstream in P1.0-1.6, but IMD will continue to penetrate, and COB will mainly compete on P1.2; At P0.9, the current packaging technology competition is still fierce, and IMD still has the cost advantage. With the downward spacing, the technical advantage of flip-chip COB will continue to emerge, and the advantage of COG below P0.6 will be highlighted. On the whole, COG will be the ultimate packaging technology trend; At present, from the case application of COG, the first 4K project of COG P0.9 of BOE Crystal Core has been successfully delivered on December 27 this year, mainly for the application of conference scenarios, which also marks that COG products have formally moved from conceptualization to landing application for Small Pixel Pitch LED Display